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Reactive Ion Etching System

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MAIN FEATURES:

Anodized aluminium based planar electrode assembly for uniform gas flow dynamics
Interchangable substrate holder assembly to accommodate various substrate sizes
Fully automatic PLC-PC based control with recipie programming
Gas manifold with mass flow controllers [mfcs] for precise process control
Capacitance diaphragm gauge and variable conductance valve for closed loop pressure control
RF power source with continuously variable power control for process optimization
Safety interlocks for operator safety
PLC-PC based automation for process control