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Rapid Thermal Processor

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The Rapid Thermal Processor offered by Milman is state of the art specially designed equipment for processing of Si, Ge, GaAs and SiC semiconductor wafers. This equipment is mainly used for applications where the substrate needs to be brought to very high temperature only for short time. The heating is Tungsten Halide lamp based and temperature measurement as well as control is of contactless type via a pyrometer (Optional). Provision is made for gas flow input and rough as well as high vacuum base. The system is provided with HMI and SCADA software, which gives flexibility for new recipes and applications.
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MAIN FEATURES: Capability to reach 1200C on silicon wafer Temperature ramp rates of 150°C/sec Control software for real time process control, data logging, and recipe editing. Optical sensor based temperature measurement for fast response and feedback. State of the art double walled SS chamber for hot zone with water cooling facility. Optimized lamp array design to provide uniformity of illumination. PLC-HMI Based SCADA package for recipe programming and storage. Closed loop PID mode (calibration mode) and intensity controlled mode operation. Safety interlocks for door and water flow. Use of “CE” certified major electrical and electronics parts. High reliability and low maintenance.