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Lab Systems for R & D

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	E-Beam Evaporator Provides common platform for thermal evaporation and electron beam evaporation with indexable four sources All stainless steel (ss304) construction of vacuum chamber valves and plumbing lines along with all viton^© o'rings and seals State of the art quartz ir lamp based substrate heating mechanism Plc-pc based automation for complete process control Glow discharge plasma cleaning facility for precleaning of substrates All interlocks for cooling water, low vacuum, compressed air failure etc. for safe operation

	Bench Top Coater Option of 3” / 4” magnetron sputtering cathode* Quartz infra red lamp based substrate heater and rotation facility. Substrate bias capability (optional). Flexibility of manual, semiautomatic or complete plc based automation. User friendly controls with active mimic displays for vacuum status.

	Triple Magnetron Sputtering System Choice of dc, pulsed dc and/or rf sputtering. Substrate rotation to give high uniformity. Quartz ir lamp based substrate heater control. PLC-PC based automation for complete process control

	Reactive Ion Etching System Anodized aluminium based planar electrode assembly for uniform gas flow dynamics Interchangable substrate holder assembly to accommodate various substrate sizes

	Rapid Thermal Processor Controlled process at 1200°c for Silicon wafer. Ramp rates of 150°c/sec. Temperature uniformity over wafer surface within ± 2%.