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Planar Sputtering Equipment

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Equipment provides for magnetron sputtering in sputter down geometry. Up to three circular cathodes are located at 120 Deg. in planar configuration. Magnetron sputtering cathodes of 2”, 3”, 4”, 6” diameter and rectangular cathodes of 5” x 8” can be provided in this configuration.

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MAIN FEATURES:

Sputter down geometry with choice of cathode size and type.
Unique design of MILMAN make magnetron sputtering cathode assemblies with rare earth magnets for high target utilization.
Closed loop pressure control electronics for precise process pressure control during sputtering.
Precision mass flow controller for process consistency.
Complete PLC / PC based automation with recipe programming, alarm management and trends/report generation.
Quartz Infrared lamp based substrate heating up to 250^oC.
Substrate rotation up to 10-30 rpm along with change of sources to substrate distance.
RF and DC along with Pulsed DC power supplies for sputtering both metals and insulators.